Nepcon China took place from 24 to 26 April 2019 at the World Expo Exhibition & Convention Center in Shanghai. Many interested visitors came to the fair to explore the latest developments in the electronics industry.

Plumbing the depths of reflow technology with the specialist books of Dr Hans Bell (Rehm Thermal Systems): in the wake of four successful volumes, the publication of the fifth marks the final part in the Rehm series "Reflow technology – Fundamentals of Reflow Soldering". At the upcoming SMTconnect event, all those who are interested will have the opportunity to have their books signed on the 8th…

productronica China, an important event for the electronics industry in the Asian region, took place at the Shanghai New International Expo Center at the end of March. Rehm Thermal Systems was there to present their new software systems and functions for the CondensoXC and VisionXP+ Vac which impressed the visitors.