News

Globally networked, locally present – Rehm Thermal Systems at NEPCON ASIA 2024

The team from the Chinese subsidiary of Rehm Thermal Systems presented its efficient and reliable system for reflow convection soldering under vacuum at NEPCON ASIA in Shenzhen from 6 to 8 November 2024.

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Flying high together – this year's trainee outing at Rehm Thermal Systems

As every year, the trainee outing at Rehm Thermal Systems was once again on the programme in 2024. All trainees and three chaperones travelled by bus first to Sinsheim to the KLIMA ARENA and then to Filderstadt to the Sprungbude.

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Review – Issue 01/2024

Read the new issue of the Review.

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The Rehm Technology Days 2024 – Where the Future Meets Technology

Traditionally, the Rehm Technology Days offer a valuable opportunity for knowledge exchange, networking and discussion. Once again this year, numerous customers, partner companies, press representatives and employees from the worldwide locations met at the company headquarters in Blaubeuren-Seissen. Under the motto "#opentochange", participants were treated to user-oriented workshops and live…

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