The Protecto enables 3D applications to be built up using a UV-curing material that can be cured directly with the aid of a suitable UV spot.

Dam & Fill" uses two materials with different viscosities. First, a dam is placed around the component to be protected using a highly viscous material. If a UV-curing material is used, it can be cured directly with the aid of a suitable UV spot. The component can then be potted in the same operation using a low-viscosity material.

In this process, a 1K or 2K (only XP) material is applied to a component such that a continuous and uniform sealing loop is produced. Volumetric applicators are particularly suitable for this purpose.

A Glob Top is used to protect a selective area on the circuit board. For this purpose, a material is used which, on the one hand, is fluid enough to securely encapsulate all the components involved, but on the other hand, is not so low in viscosity that it flows onto adjacent components.

Underfills increase the mechanical stability between the chip and the circuit board and distribute locally occurring voltages over a larger area, which significantly increases the service life. For this purpose, a low-viscosity material is applied along the edge region of the chip, which then independently fills the gap between the chip and the circuit board using the capillary effect.

Due to the constant miniaturisation in electronics, less and less surface is available for heat dissipation. This makes it all the more important to have an optimal passage between the heat sink and the component. Liquid heat-transfer media can be adapted to the individual contours better than fixed pads or foils and ensure a safe heat dissipation, which significantly increases the service life of the components.