Reliable and repeatable – for the most stringent requirements
With the CondensoX-Line, the condensation soldering process can be easily integrated under vacuum into standard SMD lines. This enables void-free soldered joints to be made in a completely inert process environment (<100ppm O2), irrespective of whether this is with standard assemblies with BGA components or a DCB substrate for power electronics. As a result of the construction with a 3-chamber system, low cycle times can be achieved for inert soldering processes. The final, gas-tight cooling chamber uses variable convection to ensure controlled and rapid cooling of the assembles and thus meets the highest of requirements for series production of power electronics.
Loading concept
- Loading with pre-assembled product carriers
- Soldering/Vacuum/Cooling under liquid
- Cooling
- Unloading product carriers
- Manual loading/unloading of individual assemblies
3-chamber system
The CondensoX-Line is set up as a 3-chamber system to achieve low cycle times with inline soldering processes. All 3 chambers can be flooded with nitrogen on a non-stop basis. In this way, void-reduced soldered joints can be made in a completely inert process environment, irrespective of whether this is with standard assemblies with BGA components or a DCB substrate for power electronics.
Pre-chamber
The pre-chamber in the CondensoX-Line can be flooded with nitrogen for pre-inerting and thus provides a protective nitrogen atmosphere for the products before they are transported to the actual soldering process.
Process chamber
The second process chamber that is suitable for vacuum can be flooded with nitrogen or forming gases and provides an inert or activating and void-reducing process atmosphere throughout the whole soldering process. In addition, formic acid can be used as an option here for flux-free process control – which is a first in the world of vapor phase soldering systems!
