The throughput of today’s vapor phase soldering systems is limited due to their process chambers. For various reasons, the vapor phase soldering process cannot be carried out using a continuous process only: on the one hand, the medium must not be displaced (due to consumption costs, safety etc.). On the other hand, the soldering procedure requires the process to be discontinuous. The advantage of…

For an optimal reflow soldering result, not only is melting of the solder important but also as a stable and reliable cooling process. This soldering process can be designed flexibly with the VisionXP+ convection soldering system from Rehm Thermal Systems. With Rehm CoolFlow, Rehm offers an innovative and integrated cooling principle using liquid nitrogen – there is also a standard cooling option…

The Rehm company has started into its 30th anniversary and had already planned and announced a corresponding anniversary event with 2-day Technology Days on 7 and 8 October 2020.