News

Contact soldering with or without a vacuum

The Nexus soldering system guarantees the best results with a reflow soldering process using contact heat under vacuum. This enables the Nexus to meet the highest requirements in the field of advanced packaging and power electronics. The contact soldering system under vacuum is also best suited for void-free soldering of different components (e.g. IGBT) on DBC substrates. The substances are…

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Rehm at the Productronica China in Shanghai

As an established manufacturer of reflow soldering systems, Rehm Thermal Systems has also made a name for itself in the Asian electronics market for more than 10 years. At the beginning of July, the thermal system solutions expert will be attending the Productronica China in Shanghai. There it will showcase the highlights of its extensive product portfolio, as well as further developments in…

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Rehm Technology Academy with current topics relating to soldering technology

Rehm will make sure you are still very well informed in these times by providing webinars on the pros and cons of soldering with nitrogen, the ViCON system software by Rehm, vacuum soldering with condensation and contact soldering processes, as well as dryer solutions. Register to acquire some new knowledge or refresh your existing knowledge. Let the Rehm experts bring you up to date with the…

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Maximum throughput for vapor phase soldering

The throughput of today’s vapor phase soldering systems is limited due to their process chambers. For various reasons, the vapor phase soldering process cannot be carried out using a continuous process only: on the one hand, the medium must not be displaced (due to consumption costs, safety etc.). On the other hand, the soldering procedure requires the process to be discontinuous. The advantage of…

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