AMPER, held in Brno in the Czech Republic, is one of the largest trade events for the electronics industry in Europe. Rehm Thermal Systems will exhibit again this year, presenting a CondensoXC Vac for condensation soldering, among other products, on 19 - 22 March 2019 in Hall F, Stand 2.12. This space-saving but nevertheless high-performance batch system is the ideal choice particularly for low throughput, and is used predominantly for laboratory applications, in batch production or in prototyping. A vacuum option is available for optimum and virtually void-free soldering results.
Just one week after AMPER, the electronics sector will flock to the Hungarian capital of Budapest for Electrosub on 3 - 5 April. Rehm will exhibit for the first time: visit our team at Stand B19 and discover the latest technology for soldering, coating, testing and hardening electronic assemblies. On the second day of the event Dr Paul Wild, Head of Research & Development at Rehm, will deliver a lecture titled “Lötprozesse – Applications und Trends” [Soldering Processes - Applications and Trends]. His lecture will explain the latest demands in the soldering of electronic assemblies and present corresponding solutions.
Rehm Thermal Systems has already exhibited its product portfolio in recent years at Russia’s largest electronics trade show, ElectronTechExpo. The manufacturer of thermal system solutions hopes to continue this success in 2019 too: On 15 - 17 April customers will have the opportunity to visit Rehm at the trade show in Moscow and in Pavilion 3, Hall 13, Stand B667 learn about the latest developments in reflow soldering under convection and condensation, as well as innovative conformal coating technology.
