First up is Nepcon South China, from 28th to 30th August at the Shenzhen Convention & Exhibition Centre in Shenzhen. At Stand 1J55 Rehm Thermal Systems will present the VisionXP+ Vac convection soldering system. This system can reliably eliminate pores, gas cavities and voids in a vacuum chamber directly after the soldering process whilst the soldering material is still in an optimum melted state. The CondensoXC condensation soldering system and the ProtectoXC coating system will also be presented at Nepcon South China. The CondensoXC is a space-saving, high-performance vapour-phase system for laboratory applications, small-batch production, or prototyping. The ProtectoXC is ideal for coating small batch sizes and is also suitable for production environments thanks to its small footprint.
Nepcon Vietnam will open its doors to trade fair visitors from 11th to 13th September. The Rehm team looks forward to welcoming you to I.C.E. Hanoi (Cung Van Hoa) at Stand I14. We will be able to discuss the latest trends and innovations in the electronics sector with you at the stand and share our experiences. From 18th to 20th September, Rehm Thermal Systems will be sharing a stand with the Taiwanese distributor Titan-Semi Co. Ltd. at Semicon Taiwan in the Nangang Exhibition Centre in Taipeh. The stand number will be K2268. At Semicon Taiwan, Rehm will be presenting the VisionX Semico 834 convection soldering system, which has been specially designed for semiconductors. The VisionX Semico is based on the proven VisionX series, which has been successfully established in the reflow soldering market for years. The optimal heat transfer through specially developed nozzle fields ensures a small delta T and thus the best process performance. The low-vibration transport, whether as braided belt, pin chain, combination transport or as single or dual lane, meets the high demands of semiconductor production and ensures additional process reliability.
