Globally networked, locally present – Rehm Thermal Systems at NEPCON ASIA 2024

The team from the Chinese subsidiary of Rehm Thermal Systems presented its efficient and reliable system for reflow convection soldering under vacuum at NEPCON ASIA in Shenzhen from 6 to 8 November 2024.

Rehm Thermal Systems can look back on a successful participation in NEPCON ASIA 2024 in Shenzhen. With 60,000 visitors, the trade fair provided an excellent platform to present the VisionXP+ Vac to a broad audience of international electronics manufacturers and a valuable opportunity for dialogue.

The demand for high-performance electronics is growing worldwide. To guarantee their flawless functionality, high-quality solder joints with very few voids are a prerequisite. Vacuum soldering has proven to be particularly suitable for this purpose: with the VisionXP+ Vac convection soldering system from Rehm Thermal Systems, pores, gas inclusions and voids can be reliably removed directly after the soldering process while the solder is still in an optimally melted state. Time-consuming post-processing of the assemblies using an external vacuum system is therefore no longer necessary.

The VisionXP+ Vac is not only characterized by productivity and particularly high process stability, but it also impresses with reduced emissions and operating costs thanks to the switch to EC motors (energy savings of around 30 %).

The VisionXP+ with vacuum chamber also impresses with minimal downtimes and low maintenance costs: soldering electronic assemblies produces soldering fumes, aerosols and solid particles (residues). Without an effective residue separation system, their concentration in the process gas atmosphere would constantly increase, resulting in a high potential for contamination and intensive maintenance and servicing costs. This is why the Vision series has been equipped with two residue management systems for many years: During pyrolysis in the heating zones, long-chain molecular compounds are cracked into short-chain molecules by heating. After cracking, the short-chain molecules no longer adhere and are small enough to be deposited in the granulate and removed from the process. During cold condensation in the cooling section, the process gas is fed through a multi-stage cooler filter system in a closed loop so that the residues condense on the cooler and particles and liquid residues can be deposited in the filter. The cleaned gas is then fed back into the process.

Rehm Thermal Systems offers the ViCON software for controlling, monitoring and analyzing production processes: for example, the current energy and nitrogen consumption can be monitored very easily and all resource efficiency data can be recorded, logged and transferred directly to a superordinate manufacturing management system.

"We were very pleased about the great interest. The many visitors from all over the world were a clear signal that trade fairs continue to play a central role in industrial networking," said Ralf Wagenfuhr, Director of Operations at Rehm Thermal Systems China. "This personal exchange remains indispensable in order to jointly tackle the challenges facing the industry and develop solutions for the future."

The next NEPCON ASIA in Shenzhen will take place from 28 to 30 October 2025 at the Shanghai World Expo Exhibition & Convention Center.