Vacuum contact soldering – perfect for power electronics
The Nexus soldering system guarantees the best results with a reflow soldering process using contact heat in a vacuum. This enables you to meet the highest requirements in the field of advanced packaging and power electronics. Productivity increases and quality advantages are achieved in the manufacturing of these components like this. In this way, the vacuum ensures oxide-free processes, as well as improved wetting and thus better filling of soldered joints. In addition, the vacuum drastically reduces the voids in soldered joints and enables processes such as plasma cleaning and atmosphere exchange for advanced packaging. Temperatures of up to 400°C can be used as standard.
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Product film Nexus
You can watch this and our other product films live at our stand or at an appointment with your contact person.
We look forward to your visit.
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Your Contact Person
Michael Hanke
C.S.O. Chief Sales Officer
Mobile: +49 160 2813251
Fax: +49 7344 9606-525
m.hanke@rehm-group.com
If you have any questions, please do not hesitate to contact us.
You can find your regional contact person here.