One of the biggest and most important trade fairs for the electronics industry is coming up: In three weeks, SMTconnect (formerly SMT Hybrid Packaging) will open its doors in Nuremberg from 7-9 May. Rehm Thermal Systems will be attending again this year, too: Come visit the Rehm team in Hall 4A, Stand 100. We’ll be delighted to see you!

Nepcon China took place from 24 to 26 April 2019 at the World Expo Exhibition & Convention Center in Shanghai. Many interested visitors came to the fair to explore the latest developments in the electronics industry.

Plumbing the depths of reflow technology with the specialist books of Dr Hans Bell (Rehm Thermal Systems): in the wake of four successful volumes, the publication of the fifth marks the final part in the Rehm series "Reflow technology – Fundamentals of Reflow Soldering". At the upcoming SMTconnect event, all those who are interested will have the opportunity to have their books signed on the 8th…