Even in March 2021, it will not be possible to celebrate our company anniversary - in conjunction with the Rehm Technology Days - due to the still poor Corona situation. An event of this magnitude will also not be possible in the foreseeable future. Therefore, we have decided to make up for our company anniversary with the Technology Days in 2023. Then, for once, we will celebrate 33 years of Rehm…

A typical question put to a manufacturer of reflow soldering systems like Rehm Thermal Systems is often: “What is the benefit of a nitrogen atmosphere?” In the following we will explore this question in relation to typical defect scenarios, including those involving solder balls, beading, voiding, whiskers, graping, head-in-pillow, wetting defects and tombstones. While soldering atmosphere…

The Nexus contact soldering system from Rehm Thermal Systems guarantees best results in reflow soldering processes using contact heat under vacuum. This enables the Nexus to meet the highest requirements in the field of advanced packaging and power electronics. The contact soldering system with a vacuum is also bespoke for void-free soldering of different components (e.g. IGBT) on DBC substrates.…