Nepcon China, which will take place from 24 to 26 April in Shanghai, is the first of the three trade fairs. With around 500 exhibitors, an exhibition space that comprises over 32,000 square metres and around 30,000 visitors, Nepcon China in Shanghai is one of the major trade fairs for the Asian electronics industry. In Hall 1, Stand 1D55 at the World Expo Exhibition and Convention Center, Rehm Thermal Systems will showcase the VisionXP+ Vac convection soldering system, the CondensoXC vapour phase soldering system and the ProtectoXC coating system. A VisionX Semico will also be presented in the SIP demonstration area in Hall 2, Stand 2Q19.
Rehm Thermal Systems will also be at the COEX Center in the South Korean capital of Seoul for Nepcon Korea from 15 to 17 May, also presenting its CondensoXC vapour phase soldering system in Hall C, Stand F145. The third major Asian trade fair for Rehm over the coming weeks is Nepcon Thailand, which will take place from 19 to 22 June at BITEC in Bangkok. Rehm will be showcasing the VisionXC convection soldering system there in Hall 98, Stand 8F37. Thanks to its compact size, it is especially suitable for small and medium batch sizes.
