Successful seminar participation in Shanghai

The seminar set up an "Intelligent Transportation Science & Technology Park", bringing together 300 leading automotive electronics manufacturers. The cutting-edge technologies presented in the areas of autonomous driving, intelligent networking, future-proof energy cars as well as vehicle electronics made the seminar an excellent event for the automotive electronics industry. The experts from Rehm Thermal Systems were able to present their expertise in the field of void-free solder joints. Especially in the automated electronics industry, the control of the occurrence of voids at the solder joints is extremely important, as it can influence the product properties as well as the product stability. The Rehm experts showed how to reduce such voids with the vacuum soldering systems from Rehm Thermal Systems.