Bondexpois regarded as the leading trade fair for bonding technology and is an important industry meeting place for all aspects of industrial joining and bonding. From 5 to 8 October, exhibitors will be presenting themselves at the Stuttgart exhibition centre, including Rehm Thermal Systems with its product portfolio in the areas of dispensing, bonding technologies and application processes. With the clear and consistent focus of Bondexpo on the joining/compounding process chain through bonding, potting, sealing and foaming, economical detailed and system solutions will be offered for the current and future challenges in the area of joining and compounding a wide variety of materials.
The electronics industry is constantly facing new challenges in the processing of sensitive electronic components: Rehm Thermal Systems offers suitable solutions and systems for these requirements, which will be presented at productronica in Munich. The world's leading trade fair for the development and production of electronics will take place this year from 16 to 19 November at the exhibition centre in Munich.
You will receive more information about the systems that will be presented at Bondexpo and productronica at a later date.
We are looking forward to welcoming you at our booth in Stuttgart and Munich!
