Additionally, temperatures of up to 400°C are often needed for joining materials. To quickly, flexibly, reproducibly, and scalably map thermal processes in the development of power electronics and in the semiconductor field, the Nexus thermal system is optimal. Heat transfer occurs through contact. Processes can be realized with minimal residual oxygen levels under nitrogen, and at the same time, the system allows the use of formic acid and forming gas for surface activation and cleaning.
In the webinar, we will introduce the system and its applications. Furthermore, we will discuss thermal profiles with special requirements and present a process in a showcase. Join us live in the webinar to see how a process is created from complex profile requirements.
Start: 4:00 p.m. CET (for Americas, Europe)
Duration: 60 min
Register now at following link:
LIVE WEBINAR High Temperature Contact Soldering
If there are any questions, please contact Sina Bartosch, mail: s.bartosch@rehm-group.com, phone: +49 7344 9606-436
