From 5 to 8 October, exhibitors will be presenting themselves at the Stuttgart exhibition centre, including Rehm Thermal Systems with its product portfolio in the areas of dispensing, bonding technologies and application processes. With the clear and consistent focus of Bondexpo on the joining/compounding process chain through bonding, potting, sealing and foaming, economical detailed and system solutions will be offered for the current and future challenges in the area of joining and compounding a wide variety of materials.
